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| d a t a sh eet product speci?cation 2002 jul 17 integrated circuits 74HC2G86; 74hct2g86 dual 2-input exclusive-or gate
2002 jul 17 2 philips semiconductors product speci?cation dual 2-input exclusive-or gate 74HC2G86; 74hct2g86 features wide supply voltage range from 2.0 to 6.0 v symmetrical output impedance high noise immunity low power dissipation balanced propagation delays very small 8 pins package output capability: standard. description the 74hc2g/hct2g86 is a high-speed si-gate cmos device. the 74hc2g/hct2g86 provides dual 2-input exclusive-or gate. quick reference data gnd = 0 v; t amb =25 c; t r =t f 6.0 ns. notes 1. c pd is used to determine the dynamic power dissipation (p d in m w). p d =c pd v cc 2 f i n+ ? (c l v cc 2 f o ) where: f i = input frequency in mhz; f o = output frequency in mhz; c l = output load capacitance in pf; v cc = supply voltage in volts; n = total switching outputs; ? (c l v cc 2 f o ) = sum of outputs. 2. for hc1g the condition is v i = gnd to v cc . for hct1g the condition is v i = gnd to v cc - 1.5 v. function table see note 1. note 1. h = high voltage level; l = low voltage level. symbol parameter conditions typical unit hc2g86 hct2g86 t phl /t plh propagation delay na to ny c l = 50 pf; v cc =4.5v1111ns c i input capacitance 1.5 1.5 pf c pd power dissipation capacitance per gate notes 1 and 2 10 9 pf inputs inputs outputs na na ny lll lhh hlh hhl 2002 jul 17 3 philips semiconductors product speci?cation dual 2-input exclusive-or gate 74HC2G86; 74hct2g86 ordering information pinning type number packages temperature range pins package material code marking 74HC2G86dp - 40 to +125 c 8 tssop-8 plastic sot505-2 h86 74hct2g86dp - 40 to +125 c 8 tssop-8 plastic sot505-2 t86 pin symbol description 1 1a data input 1a 2 1b data input 1b 3 2y data output 2y 4 gnd ground (0 v) 5 2a data input 2a 6 2b data input 2b 7 1y data output 1y 8v cc supply voltage handbook, halfpage 1 2 3 4 8 7 6 5 mna736 86 v cc 1y 1b 2b 2a gnd 2y 1a fig.1 pin configuration. handbook, halfpage mna737 1a 1b 1y 2 1 7 2a 2b 2y 6 5 3 fig.2 logic symbol. 2002 jul 17 4 philips semiconductors product speci?cation dual 2-input exclusive-or gate 74HC2G86; 74hct2g86 handbook, halfpage mna738 7 = 1 = 1 2 1 3 6 5 fig.3 iec logic symbol. handbook, halfpage mna040 y b a fig.4 logic diagram (one driver). recommended operating conditions limiting values in accordance with the absolute maximum rating system (iec 60134); voltages are referenced to gnd (ground = 0 v). notes 1. the input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. above 110 c the value of p d derates linearly with 8 mw/k. symbol parameter conditions 74HC2G86 74hct2g86 unit min. typ. max. min. typ. max. v cc supply voltage 2.0 5.0 6.0 4.5 5.0 5.5 v v i input voltage 0 - v cc 0 - v cc v v o output voltage 0 - v cc 0 - v cc v t amb operating ambient temperature see dc and ac characteristics per device - 40 +25 +125 - 40 +25 +125 c t r ,t f input rise and fall times v cc = 2.0 v -- 1000 --- ns v cc = 4.5 v - 6.0 500 - 6.0 500 ns v cc = 6.0 v -- 400 --- ns symbol parameter conditions min. max. unit v cc supply voltage - 0.5 +7.0 v i ik input diode current v i < - 0.5 v or v i >v cc + 0.5 v; note 1 - 20 ma i ok output diode current v o < - 0.5 v or v o >v cc + 0.5 v; note 1 - 20 ma i o output source or sink current - 0.5v 2002 jul 17 6 philips semiconductors product speci?cation dual 2-input exclusive-or gate 74HC2G86; 74hct2g86 type 74hct2g86 over recommended operating conditions; voltages are referenced to gnd (groun d=0v). symbol parameter test conditions t amb ( c) unit other v cc (v) 25 - 40 to +85 - 40 to +125 min. typ. max. min. max. min. max. v ih high-level input voltage 4.5 to 5.5 2.0 1.6 - 2.0 - 2.0 - v v il low-level input voltage 4.5 to 5.5 - 1.2 0.8 - 0.8 - 0.8 v v oh high-level output voltage v i =v ih or v il ; i o = - 20 m a 4.5 4.4 4.5 - 4.4 - 4.4 - v v i =v ih or v il ; i o = - 4.0 ma 4.5 4.18 4.32 - 4.13 - 3.7 - v v ol low-level output voltage v i =v ih or v il ; i o =20 m a 4.5 - 0 0.1 - 0.1 - 0.1 v v i =v ih or v il ; i o = 4.0 ma 4.5 - 0.15 0.26 - 0.33 - 0.4 v i li input leakage current v i =v cc or gnd 5.5 -- 0.1 - 1.0 - 1.0 m a i cc quiescent supply current v i =v cc or gnd; i o =0 5.5 -- 1.0 - 10 - 20 m a d i cc additional supply current per input v i =v cc - 2.1 v; i o =0 4.5 to 5.5 -- 300 - 375 - 410 m a 2002 jul 17 7 philips semiconductors product speci?cation dual 2-input exclusive-or gate 74HC2G86; 74hct2g86 ac characteristics type 74HC2G86 gnd = 0 v; t r =t f 6.0 ns; c l =50pf. type 74hct2g86 gnd = 0 v; t r =t f 6.0 ns; c l =50pf. symbol parameter test conditions t amb ( c) unit waveforms v cc (v) 25 - 40 to +85 - 40 to +125 min. typ. max. min. max. min. max. t phl /t plh propagation delay na, nb to ny see figs 5 and 6 2.0 - 34 120 - 150 - 180 ns 4.5 - 11 20 - 25 - 36 ns 6.0 - 917 - 21 - 30 ns t thl /t tlh output transition time see figs 5 and 6 2.0 - 18 75 - 95 - 110 ns 4.5 - 615 - 19 - 22 ns 6.0 - 513 - 16 - 20 ns symbol parameter test conditions t amb ( c) unit waveforms v cc (v) 25 - 40 to +85 - 40 to +125 min. typ. max. min. max. min. max. t phl /t plh propagation delay na, nb to ny see figs 5 and 6 4.5 - 11 19 - 23 - 48 ns t thl /t tlh output transition time see figs 5 and 6 4.5 - 615 - 19 - 22 ns 2002 jul 17 8 philips semiconductors product speci?cation dual 2-input exclusive-or gate 74HC2G86; 74hct2g86 ac waveforms handbook, halfpage mna726 t plh t phl v m v m 90% 10% v m v m ny output na, nb input v i gnd v oh v ol t tlh t thl fig.5 the input (na, nb) to output (ny) propagation delays. for hc2g: v m = 50%; v i = gnd to v cc . for hct2g: v m = 1.3 v; v i = gnd to 3.0 v. handbook, full pagewidth open gnd 50 pf v cc v cc v i v o mna742 d.u.t. c l r t r l 1 k w pulse generator s1 fig.6 load circuitry for switching times. definitions for test circuit: c l = load capacitance including jig and probe capacitance (see. r t = termination resistance should be equal to the output impedance z o of the pulse generator. test s 1 t plh /t phl open t plz /t pzl v cc t phz /t pzh gnd 2002 jul 17 9 philips semiconductors product speci?cation dual 2-input exclusive-or gate 74HC2G86; 74hct2g86 package outline unit a 1 a max. a 2 a 3 b p l h e l p wy v ce d (1) e (1) z (1) q references outline version european projection issue date iec jedec jeita mm 0.15 0.00 0.95 0.75 0.38 0.22 0.18 0.08 3.1 2.9 3.1 2.9 0.65 4.1 3.9 0.70 0.35 8 0 0.13 0.1 0.2 0.5 dimensions (mm are the original dimensions) note 1. plastic or metal protrusions of 0.15 mm maximum per side are not included. 0.47 0.33 sot505-2 - - - 02-01-16 w m b p d z e 0.25 14 8 5 q a 2 a 1 l p (a 3 ) detail x a l h e e c v m a x a y 2.5 5 mm 0 scale tssop8: plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0.5 mm sot505-2 1.1 pin 1 index 2002 jul 17 10 philips semiconductors product speci?cation dual 2-input exclusive-or gate 74HC2G86; 74hct2g86 soldering introduction to soldering surface mount packages this text gives a very brief insight to a complex technology. a more in-depth account of soldering ics can be found in our data handbook ic26; integrated circuit packages (document order number 9398 652 90011). there is no soldering method that is ideal for all surface mount ic packages. wave soldering can still be used for certain surface mount ics, but it is not suitable for fine pitch smds. in these situations reflow soldering is recommended. re?ow soldering reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. typical reflow peak temperatures range from 215 to 250 c. the top-surface temperature of the packages should preferable be kept below 220 c for thick/large packages, and below 235 c for small/thin packages. wave soldering conventional single wave soldering is not recommended for surface mount devices (smds) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. to overcome these problems the double-wave soldering method was specifically developed. if wave soldering is used the following conditions must be observed for optimal results: use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. for packages with leads on two sides and a pitch (e): C larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; C smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. the footprint must incorporate solder thieves at the downstream end. for packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. the footprint must incorporate solder thieves downstream and at the side corners. during placement and before soldering, the package must be fixed with a droplet of adhesive. the adhesive can be applied by screen printing, pin transfer or syringe dispensing. the package can be soldered after the adhesive is cured. typical dwell time is 4 seconds at 250 c. a mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. manual soldering fix the component by first soldering two diagonally-opposite end leads. use a low voltage (24 v or less) soldering iron applied to the flat part of the lead. contact time must be limited to 10 seconds at up to 300 c. when using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 c. 2002 jul 17 11 philips semiconductors product speci?cation dual 2-input exclusive-or gate 74HC2G86; 74hct2g86 suitability of surface mount ic packages for wave and re?ow soldering methods notes 1. for more detailed information on the bga packages refer to the (lf)bga application note (an01026); order a copy from your philips semiconductors sales office. 2. all surface mount (smd) packages are moisture sensitive. depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). for details, refer to the drypack information in the data handbook ic26; integrated circuit packages; section: packing methods . 3. these packages are not suitable for wave soldering. on versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. on versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. 4. if wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. the package footprint must incorporate solder thieves downstream and at the side corners. 5. wave soldering is suitable for lqfp, tqfp and qfp packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 6. wave soldering is suitable for ssop and tssop packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. package (1) soldering method wave reflow (2) bga, lbga, lfbga, sqfp, tfbga, vfbga not suitable suitable hbcc, hbga, hlqfp, hsqfp, hsop, htqfp, htssop, hvqfn, hvson, sms not suitable (3) suitable plcc (4) , so, soj suitable suitable lqfp, qfp, tqfp not recommended (4)(5) suitable ssop, tssop, vso not recommended (6) suitable 2002 jul 17 12 philips semiconductors product speci?cation dual 2-input exclusive-or gate 74HC2G86; 74hct2g86 data sheet status notes 1. please consult the most recently issued data sheet before initiating or completing a design. 2. the product status of the device(s) described in this data sheet may have changed since this data sheet was published. the latest information is available on the internet at url http://www.semiconductors.philips.com. data sheet status (1) product status (2) definitions objective data development this data sheet contains data from the objective specification for product development. philips semiconductors reserves the right to change the speci?cation in any manner without notice. preliminary data quali?cation this data sheet contains data from the preliminary specification. supplementary data will be published at a later date. philips semiconductors reserves the right to change the speci?cation without notice, in order to improve the design and supply the best possible product. product data production this data sheet contains data from the product specification. philips semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. changes will be communicated according to the customer product/process change noti?cation (cpcn) procedure snw-sq-650a. definitions short-form specification ? the data in a short-form specification is extracted from a full data sheet with the same type number and title. for detailed information see the relevant data sheet or data handbook. limiting values definition ? limiting values given are in accordance with the absolute maximum rating system (iec 60134). stress above one or more of the limiting values may cause permanent damage to the device. these are stress ratings only and operation of the device at these or at any other conditions above those given in the characteristics sections of the specification is not implied. exposure to limiting values for extended periods may affect device reliability. application information ? applications that are described herein for any of these products are for illustrative purposes only. philips semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. disclaimers life support applications ? these products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. philips semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify philips semiconductors for any damages resulting from such application. right to make changes ? philips semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. philips semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. 2002 jul 17 13 philips semiconductors product speci?cation dual 2-input exclusive-or gate 74HC2G86; 74hct2g86 notes 2002 jul 17 14 philips semiconductors product speci?cation dual 2-input exclusive-or gate 74HC2G86; 74hct2g86 notes 2002 jul 17 15 philips semiconductors product speci?cation dual 2-input exclusive-or gate 74HC2G86; 74hct2g86 notes ? koninklijke philips electronics n.v. 2002 sca74 all rights are reserved. reproduction in whole or in part is prohibited without the prior written consent of the copyright owne r. the information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. no liability will be accepted by the publisher for any consequence of its use. publication thereof does not con vey nor imply any license under patent- or other industrial or intellectual property rights. philips semiconductors C a worldwide company contact information for additional information please visit http://www.semiconductors.philips.com . fax: +31 40 27 24825 for sales of?ces addresses send e-mail to: sales.addresses@www.semiconductors.philips.com . printed in the netherlands 613508/01/pp 16 date of release: 2002 jul 17 document order number: 9397 750 09978 |
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